Organic light-emitting display device

ABSTRACT

An organic light-emitting display device includes a substrate having a display region and a peripheral region, a plurality of pixels on the substrate in the display region, a first wiring and a second wiring on the substrate in the peripheral region, a compensation layer on the first and second wirings, the compensation layer surrounding a top surface and a sidewall of each of the first and second wirings, and an encapsulation layer on the plurality of pixels and on the compensation layer.

CROSS-REFERENCE TO RELATED APPLICATION

Korean Patent Application No. 10-2015-0183520, filed on Dec. 22, 2015,in the Korean Intellectual Property Office, and entitled: “OrganicLight-Emitting Display Device,” is incorporated by reference herein inits entirety.

BACKGROUND

1. Field

Example embodiments relate to display devices. More particularly,example embodiments relate to organic light-emitting display devicesincluding a compensation layer that compensates a stepped region derivedfrom wirings.

2. Description of the Related Art

An organic light-emitting display device may have an organiclight-emitting structure including a hole injection layer, an electroninjection layer, and an organic light-emitting layer formedtherebetween. In the organic light-emitting display device, light may begenerated as excitons, that are the combination of holes injected fromthe hole injection layer and electrons injected from the electroninjection layer, fall from an excited state to a ground state. Theorganic light-emitting display device may not require a separate lightsource, and thus the organic light-emitting display device may have asmall thickness and a light weight, as well as low power consumption.Furthermore, the organic light-emitting display device may have a wideviewing angle, a high contrast, and a high response speed, etc.

However, the organic light-emitting structure may be easily degraded byvapor or oxygen from the outside. Therefore, an encapsulation member maybe required to protect the organic light-emitting structure from thevapor or the oxygen. Recently, an encapsulation layer has been used asthe encapsulation member for the organic light-emitting structure tomake the organic light-emitting structure thin and flexible.

SUMMARY

According to an aspect of example embodiments, an organic light-emittingdisplay device may include a substrate having a display region and aperipheral region, a plurality of pixels disposed on the substrate inthe display region, a first wiring and a second wiring disposed on thesubstrate in the peripheral region, a compensation layer disposed on thefirst and second wirings, and an encapsulation layer disposed on theplurality of pixels and on the compensation layer. The compensationlayer may surround a top surface and a sidewall of each of the first andsecond wirings.

In example embodiments, the compensation layer may compensate a steppedregion derived from the first and second wirings.

In example embodiments, the first wiring may supply a driving voltage tothe plurality of pixels, and the second wiring may supply a commonvoltage to the plurality of pixels.

In example embodiments, each of the plurality of pixels may include apixel circuit having an active pattern, a gate electrode, an insulationinterlayer, a source electrode and a drain electrode, and an organiclight-emitting structure having a pixel electrode, an organiclight-emitting layer and a common electrode. The organic light-emittingstructure may be electrically connected to the pixel circuit.

In example embodiments, the first and second wirings, and the gateelectrode may be disposed at substantially the same level over thesubstrate. The compensation layer and the insulation interlayer may bedisposed at substantially the same level over the substrate.

In example embodiments, each of the plurality of pixels may furtherinclude an insulation layer disposed between the source and the drainelectrodes, and the pixel electrode, and a pixel defining layer disposedon the insulation layer. The pixel defining layer may expose a portionof the pixel electrode.

In example embodiments, the encapsulation layer may include at least oneorganic layer and at least one inorganic layer.

In some example embodiments, the encapsulation layer may have astructure in which a first inorganic layer, an organic layer, and asecond inorganic layer are stacked.

According to another aspect of example embodiments, an organiclight-emitting display device may include a substrate having a displayregion and a peripheral region, a plurality of pixels disposed on thesubstrate in the display region, a first wiring and a second wiringdisposed on the substrate in a peripheral region, an interwiringinsulation layer surrounding a top surface and a sidewall of each of thefirst and second wirings, a third wiring disposed on the interwiringinsulation layer, the third wiring being electrically connected to thefirst wiring, a fourth wiring disposed on the interwiring insulationlayer, the fourth wiring being electrically connected to the secondwiring, a compensation layer disposed on the third and fourth wirings,and an encapsulation layer disposed on the plurality of pixels and onthe compensation layer. The compensation layer may surround a topsurface and a sidewall of each of the third and fourth wirings.

In example embodiments, the compensation layer may compensate a steppedregion derived from the third and fourth wirings.

In example embodiments, the first and the third wirings may supply adriving voltage to the plurality of pixels, and the second and thefourth wirings may supply a common voltage to the plurality of pixels.

In example embodiments, the interwiring insulation layer may have afirst contact hole exposing the first wiring and a second contact holeexposing the second wiring. The third wiring may fill the first contacthole to be contacted to the first wiring, and the fourth wiring may fillthe second contact hole to be contacted to the second wiring.

In example embodiments, each of the plurality of pixels may include apixel circuit having an active pattern, a first gate electrode, a gateinsulation layer, a second gate electrode, an insulation interlayer, asource electrode and a drain electrode, and an organic light-emittingstructure having a pixel electrode, an organic light-emitting layer anda common electrode. The organic light-emitting structure may beelectrically connected to the pixel circuit.

In example embodiments, the first and second wirings, and the first gateelectrode may be disposed at substantially the same level over thesubstrate. The third and fourth wirings, and the second gate electrodemay be disposed at substantially the same level over the substrate.

In example embodiments, the compensation layer and the insulationinterlayer may be disposed at substantially the same level over thesubstrate. The interwiring insulation layer and the gate insulationlayer may be disposed at substantially the same level over thesubstrate.

In example embodiments, each of the plurality of pixels may furtherinclude an insulation layer disposed between the source and the drainelectrodes, and the pixel electrode, and a pixel defining layer disposedon the insulation layer. The pixel defining layer may expose a portionof the pixel electrode.

In example embodiments, the encapsulation layer may include at least oneorganic layer and at least one inorganic layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of ordinary skill in the art bydescribing in detail exemplary embodiments with reference to theattached drawings, in which:

FIG. 1 illustrates a plan view of an organic light-emitting displaydevice in accordance with example embodiments.

FIG. 2 illustrates a circuit diagram of a pixel of the organiclight-emitting display device in FIG. 1.

FIG. 3 illustrates a plan view of a portion ‘X’ of the organiclight-emitting display device in FIG. 1.

FIG. 4 illustrates a cross-sectional view along line I-I′ of FIG. 1.

FIG. 5 illustrates a cross-sectional view along line I-I′ of FIG. 1 inaccordance with other example embodiments.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer orsubstrate, it can be directly on the other layer or substrate, orintervening layers may also be present. In addition, it will also beunderstood that when a layer is referred to as being “between” twolayers, it can be the only layer between the two layers, or one or moreintervening layers may also be present. Like reference numerals refer tolike elements throughout.

Hereinafter, organic light-emitting display devices in accordance withexample embodiments will be explained in detail with reference to theaccompanying drawings.

FIG. 1 is a plan view illustrating an organic light-emitting displaydevice in accordance with example embodiments. FIG. 2 is a circuitdiagram illustrating a pixel of the organic light-emitting displaydevice in FIG. 1.

Referring to FIG. 1, an organic light-emitting display device 100 mayinclude a plurality of pixels PX, a first wiring part 130, a secondwiring part 140, an encapsulation layer 150, a pad part 170, an embeddedcircuit part 180, etc. For example, the organic light-emitting displaydevice 100 may have a display region 110 and a peripheral region 120.

An image may be displayed by the pixels PX in the display region 110 ofthe organic light-emitting display device 100. For example, the displayregion 110 may be substantially located on a center portion of theorganic light-emitting display device 100.

A plurality of lines 175, 185 and 195 may be disposed in the displayregion 110. The lines 175, 185 and 195 may include a plurality of datalines 175 for transferring data signals to the pixels PX, a plurality ofgate lines 185 for transferring gate signals (or scan signals) to thepixels PX, and a plurality of power voltage lines 195 for transferring adriving voltage ELVDD to the pixels PX, etc. The data lines 175 and thepower voltage lines 195 may be substantially parallel to each other, andmay extend along a first direction. The gate lines 185 may extend alonga second direction substantially perpendicular to the first direction.

The plurality of pixels PX disposed in the display region 110 fordisplaying the image may be arranged as a substantial matrix structure.

Referring to FIG. 2, each pixel PX may include a pixel circuit and anorganic light-emitting structure 330. The pixel circuit may include aswitching transistor 300, a driving transistor 310, a capacitor 320,etc. FIG. 2 illustrates the pixel circuit having two transistors and onecapacitor, however embodiments may not be limited thereto, e.g., thepixel circuit may include at least three transistors and/or at least twocapacitors.

The switching transistor 300 may have a control electrode, an inputelectrode, and an output electrode. The control electrode may beconnected to the gate line 185, the input electrode may be connected tothe data line 175, and the output electrode may be connected to thedriving transistor 310. The switching transistor 300 may transfer thedata signal from the data line 175 to the driving transistor 310 basedon the gate signal from the gate line 185.

The driving transistor 310 may have a control electrode, an inputelectrode, and an output electrode. The control electrode may beconnected to the switching transistor 300, the input electrode may beconnected to the power voltage line 195, and the output electrode may beconnected to the organic light-emitting structure 330. The drivingtransistor 310 may transfer an output current ID to the organiclight-emitting structure 330 based on a voltage between the controlelectrode and the output electrode.

The capacitor 320 may be connected between the control electrode and theinput electrode of the driving transistor 310. The capacitor 320 maycharge the data signal applied to the control electrode of the drivingtransistor 310, and the capacitor 320 may maintain the data signal afterthe switching transistor 300 is turned-off.

The organic light-emitting structure 330 may have an anode connected tothe output electrode of the driving transistor 310 and a cathodereceiving a common voltage ELVSS. The organic light-emitting structure330 may emit light based on the output current ID from the drivingtransistor 310 to display an image.

Referring to FIG. 1 again, the image may not be displayed in theperipheral region 120 of the organic light-emitting display device 100.The peripheral region 120 may substantially surround the display region110, and may be located in outer portion of the organic light-emittingdisplay device 100.

The embedded circuit part 180 having a driver circuit for driving thepixels PX may be disposed in the peripheral region 120. The embeddedcircuit part 180 may include the driver circuit (e.g., a gate driverand/or a light emission control driver) for driving the pixels PX, andmay further include an inspection circuit, etc. The embedded circuitpart 180 may be located in both sides of the display region 110,however, the embedded circuit part 180 may be located in one side of thedisplay region 110, alternatively.

The pad part 170 may be disposed in the peripheral region 120. Varioussignals (e.g., the data signal) may be applied to the pad part 170 froman external device, and a flexible printed circuit 197, on whichintegrated circuits are mounted, may be electrically connected to thepad part 170.

The first wiring part 130 and the second wiring part 140 may be disposedin the peripheral region 120. The first wiring part 130 may be locatedat one side of the organic light-emitting display device 100. The secondwiring part 140 may be located to surround the display region 110.

One side of the first wiring part 130 may be connected to the flexibleprinted circuit 197. Another side of the first wiring part 130 may beconnected to the power voltage lines 195. The first wiring part 130 maytransfer the driving voltage ELVDD from the flexible printed circuit 197to the power voltage lines 195.

The second wiring part 140 may be connected to the flexible printedcircuit 197. The second wiring part 140 may transfer the common voltageELVSS from the flexible printed circuit 197 to the pixels PX.

The encapsulation layer 150 may be, e.g., continuously, disposed overthe pixels PX, over the first wiring part 130, and over the secondwiring part 140. The encapsulation layer 150 may block vapor or oxygenfrom outside to protect the pixels PX, the first wiring part 130, andthe second wiring part 140.

In example embodiments, the encapsulation layer 150 may include at leastone organic layer and at least one inorganic layer. For example, theencapsulation layer 150 may include at least two inorganic layers and atleast one organic layer. In this case, the organic layer may be disposedbetween the inorganic layers. In other words, the encapsulation layer150 may have a structure in which a first inorganic layer 151 in FIG. 4,an organic layer 152 in FIG. 4, and a second inorganic layer 153 in FIG.4 are sequentially stacked. For example, the inorganic layer may includeat least one of aluminum oxide (AlO_(x)), silicon oxide (SiO_(x)),silicon nitride (SiN_(x)), silicon oxynitride (SiO_(x)N_(y)), siliconcarbide (SiC_(x)), titanium oxide (TiO_(x)), zirconium oxide (ZrO_(x))and/or zinc oxide (ZnO_(x)). Furthermore, the organic layer may includeepoxy, polyimide (PI), polyethylene terephthalate(PET), polycarbonate(PC), polyethylene (PE) and/or polyacrylate. The inorganic layer(s) mayblock permeation of oxygen or vapor, and the organic layer may provideflexibility to the organic light-emitting display device 100.

FIG. 3 is a plan view illustrating an enlarged portion ‘X’ of theorganic light-emitting display device in FIG. 1.

Referring to FIGS. 1 and 3, the peripheral region 120 may include afirst sub-region 122, a second sub-region 124, and a third sub-region126. The first sub-region 122 may be located adjacent to the displayregion 110. The second sub-region 124 may be located adjacent to theflexible printed circuit 197, e.g., most remote from the display region110 among the first through third sub-regions 122 through 126. The thirdsub-region 126 may be located between the first sub-region 122 and thesecond sub-region 124.

In example embodiments, organic insulation layers (e.g., an insulationlayer and a pixel defining layer) may be disposed between the first andsecond wiring parts 130 and 140, and the encapsulation layer 150. Whenthe organic insulation layers are disposed in the entirety of thedisplay region 110 and the peripheral region 120, vapor or oxygen maypermeate from outside to the peripheral region 120 to pass through theorganic insulation layer into the display region 110. In this case, thevapor or oxygen may contact the pixels PX disposed in the display region110, so that the organic light-emitting structure 330 may be degraded.

Therefore, according to embodiments, a portion of the organic insulationlayer in the third sub-region 126 of the peripheral region 120 may beremoved to prevent above mentioned degradation of the organiclight-emitting structure 330. Therefore, an inflow path of the vapor oroxygen from outside to the organic light-emitting structure 330 may beblocked, so that the degradation of the organic light-emitting structure330 may be prevented. This will be described in more detail below withreference to FIG. 4.

FIG. 4 is a cross-sectional view along line I-I′ in FIG. 1. For example,the right side of FIG. 4 illustrates the horizontal part of line I-I′(crossing elements 130 and 140 in the peripheral region 120), and theleft side of FIG. 4 illustrates the vertical part of line I-I′ (crossingthe pixel PX in the display region 110).

Referring to FIG. 4, the organic light-emitting display device 100 mayinclude a substrate 200, a pixel circuit, the first wiring part 130, thesecond wiring part 140, a compensation layer 160, the organiclight-emitting structure 330, the encapsulation layer 150, etc. Inexample embodiments, the first wiring part 130 may include a firstwiring 132, and the second wiring part 140 may include a second wiring142. The organic light-emitting structure 330 may include a pixelelectrode 260, an organic light-emitting layer 280, and a commonelectrode 290, etc.

The pixel circuit may include the driving transistor 310 and thecapacitor 320. The pixel circuit may further include the switchingtransistor of FIG. 2 (not illustrated in FIG. 4 for convenience). Forexample, each of the driving transistor 310 and the switching transistormay correspond to a thin film transistor. The driving transistor 310 mayinclude a first active pattern 210 a, a first gate electrode 220 a, asource electrode 240, and a drain electrode 245. The capacitor 320 mayinclude a second active pattern 210 b and a second gate electrode 220 b.

For example, the substrate 200 may include a transparent substrate,e.g., a glass substrate, a quartz substrate, a transparent plasticsubstrate, etc. In another example, the substrate 200 may include aflexible substrate.

A buffer layer 205 may be disposed on the substrate 200. The bufferlayer 205 may extend from the display region 110 to the peripheralregion 120. The buffer layer 205 may prevent a diffusion of impuritiesgenerated from the substrate 200, and may control a transfer rate ofheat during a crystallization process for forming the first and secondactive patterns 210 a and 210 b. For example, the buffer layer 205 mayinclude silicon oxide (SiO_(x)), silicon nitride (SiN_(x)), siliconoxynitride (SiO_(x)N_(y)), etc. Here, the buffer layer 205 may have asingle layer structure or a multi-layer structure. Alternatively, thebuffer layer 205 may be omitted.

The first active pattern 210 a and the second active pattern 210 b maybe disposed on the buffer layer 205. Each of the first and second activepatterns 210 a and 210 b may include a silicon compound or apolysilicon. A source region and a drain region may be disposed at bothsides of the first active pattern 210 a, and each of the source regionand the drain region may include impurities. In addition, the secondactive pattern 210 b may include impurities, and the impurities may bedistributed around the second active pattern 210 b. In some exampleembodiments, each of the first and second active patterns 210 a and 210b may include oxide semiconductor, e.g., indium-gallium-zinc oxide(IGZO), zinc-tin oxide (ZTO) or indium-tin-zinc oxide (ITZO).

A gate insulation layer 215 may be disposed on the buffer layer 205 tosubstantially cover the first and second active patterns 210 a and 210b. The gate insulation layer 215 may extend from the display region 110to the peripheral region 120. For example, the gate insulation layer 215may include silicon oxide (SiO_(x)), silicon nitride (SiN_(x)), siliconoxynitride (SiO_(x)N_(y)), etc. Here, the gate insulation layer 215 mayhave a single layer structure or a multi-layer structure.

The first gate electrode 220 a and the second gate electrode 220 b maybe disposed on the gate insulation layer 215 in the display region 110.The first gate electrode 220 a and the second gate electrode 220 b maybe disposed over the first active pattern 210 a and the second activepattern 210 b, respectively. For example, each of the first and secondgate electrodes 220 a and 220 b may include aluminum (Al), silver (Ag),tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo),titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd), scandium(Sc), alloys thereof, or nitrides thereof. These may be used alone or ina combination thereof.

The first wiring 132 and the second wiring 142 may be disposed on thegate insulation layer 215 in the peripheral region 120. The first wiring132 and the second wiring 142 may be spaced apart from each other at apredetermined distance, and may be disposed at substantially the samelevel over the substrate 200, e.g., at a same distance from a bottomsurface of the substrate 200. Moreover, the first and second wirings 132and 142 may be disposed at substantially the same level as the first andsecond gate electrodes 220 a and 220 b over the substrate 200, e.g., thefirst and second wirings 132 and 142 may be directly on a same elementas the first and second gate electrodes 220 a and 220 b. In exampleembodiments, the first and second wirings 132 and 142 may includesubstantially the same material as the first and second gate electrodes220 a and 220 b.

An insulation interlayer 235 may be disposed on the gate insulationlayer 215 in the display region 110 to substantially cover the first andsecond gate electrodes 220 a and 220 b. For example, the insulationinterlayer 235 may include silicon oxide (SiO_(x)), silicon nitride(SiN_(x)), silicon oxynitride (SiO_(x)N_(y)), etc. Here, the insulationinterlayer 235 may have a single layer structure or a multi-layerstructure.

The source electrode 240 and the drain electrode 245 may be disposed onthe insulation interlayer 235. Each of the source electrode 240 and thedrain electrode 245 may pass through the insulation interlayer 235 andthe gate insulation layer 215 to contact the first active pattern 210 a.For example, each of the source electrode 240 and the drain electrode245 may include aluminum (Al), silver (Ag), tungsten (W), copper (Cu),nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum(Pt), tantalum (Ta), neodymium (Nd), scandium (Sc), alloys thereof, ornitrides thereof. These may be used alone or in a combination thereof.

In example embodiments, the driving transistor may include the firstactive pattern 210 a, the gate insulation layer 215, the first gateelectrode 220 a, the source electrode 240, and the drain electrode 245,and the capacitor 320 may include the second active pattern 210 b, thegate insulation layer 215, and the second gate electrode 220 b.

An insulation layer 250 may be disposed on the insulation interlayer235. The insulation layer 250 may substantially cover the sourceelectrode 240 and the drain electrode 245. A via structure forelectrically connecting the pixel electrode 260 and the drain electrode245 may be provided in the insulation layer 250. In example embodiments,a contact hole exposing a portion of the drain electrode 245 may beprovided in the insulation layer 250, and the pixel electrode 260 mayfill the contact hole to contact the drain electrode 245. In otherexample embodiments, a contact including a conductive material may beprovided in the contact hole, and the pixel electrode 260 and the drainelectrode 245 may contact a top portion and a bottom portion of thecontact, respectively. The insulation layer 250 may substantially serveas a planarization layer for upper structures. For example, theinsulation layer 250 may include an organic material, e.g., polyimide,epoxy-based resin, acryl-based resin, polyester, or the like.

The insulation layer 250 may be disposed in the display region 110.However, the insulation layer 250 may not be disposed in the thirdsub-region 126 of FIG. 3. Therefore, a path for vapor or oxygen to movefrom outside to elements in the display region 110 may be blocked.

The pixel electrode 260 may be disposed on the insulation layer 250. Asdiscussed previously, the pixel electrode 260 may fill the contact holeto contact the drain electrode 245, or the pixel electrode 260 may beelectrically connected to the drain electrode 245 through the contactprovided in the contact hole. For example, the pixel electrode 260 mayinclude aluminum (Al), silver (Ag), tungsten (W), copper (Cu), nickel(Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt),tantalum (Ta), neodymium (Nd), scandium (Sc), or alloys thereof.Alternatively, the pixel electrode 260 may include a transparentconductive material. In example embodiments, the pixel electrode 260 maybe individually disposed per each pixel.

A pixel defining layer 270 may be disposed in the display region 110,and may not be disposed in the third sub-region 126. Therefore, a pathfor vapor or oxygen to move from outside to elements in the displayregion 110 may be blocked.

The organic light-emitting layer 280 may be disposed on the pixelelectrode 260. The organic light-emitting layer 280 may include a hostmaterial excited by holes and electrons, and a dopant material forfacilitating an absorbance and a release of energy and improving alight-emitting efficiency. Alternatively, the organic light-emittingstructure 330 may further include a hole transport layer (HTL)interposed between the pixel electrode 260 and the organiclight-emitting layer 280. The organic light-emitting structure 330 mayfurther include an electron transport layer (ETL) interposed between thecommon electrode 290 and the organic light-emitting layer 280.

The common electrode 290 may be disposed on the organic light-emittinglayer 280 and on the pixel defining layer 270. The common electrode 290may face the pixel electrode 260 with respect to the organiclight-emitting layer 280. For example, the common electrode 290 mayinclude a metal having a relatively low work function, e.g., aluminum(Al), silver (Ag), tungsten (W), copper (Cu), nickel (Ni), chromium(Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta),neodymium (Nd), scandium (Sc), or alloys thereof. In exampleembodiments, the pixel electrode 260 and the common electrode 290 may beprovided as an anode and a cathode of the organic light-emittingstructure 330, respectively.

The encapsulation layer 150 may substantially cover an entirety of thedisplay region 110 and the peripheral region 120 over the substrate 200.In example embodiments, the encapsulation layer 150 may be disposed onthe common electrode 290 in the display region 110, and may be disposedover the first and second wirings 132 and 142 in the peripheral region120. Here, as illustrated in a portion ‘Y’ in FIG. 4, the encapsulationlayer 150 may have a stepped region along a profile of the first andsecond wirings 132 and 142. If the encapsulation layer 150 were to bedirectly located on a top surface and a sidewall of each of the firstand second wirings 132 and 142, damage (e.g., a crack) could occur inthe stepped region of the encapsulation layer 150, so that properties ofthe organic light-emitting display device 100 could be decreased.

Therefore, according to embodiments, the compensation layer 160 isdisposed between the first and second wirings 132 and 142, and theencapsulation layer 150, and may surround the top surface and thesidewall of each of the first and second wirings 132 and 142. In otherwords, the compensation layer 160 may, e.g., conformally, cover the topsurface and the sidewall of each of the first and second wirings 132 and142, e.g., to reduce a height of a stepped region formed by the firstand second wirings 132 and 142. Therefore, the compensation layer 160may compensate a stepped region derived from the first and secondwirings 132 and 142, so damage (e.g., a crack) on the encapsulationlayer 150 may be prevented.

In detail, the compensation layer 160 may be disposed on the gateinsulation layer 215 in the peripheral region 120. In exampleembodiments, the compensation layer 160 and the insulation interlayer235 may be disposed at substantially the same level over the substrate200. In other words, the insulation interlayer 235 may extend, e.g.,continuously, from the display region 110 to the peripheral region 120,and may serve as the compensation layer 160 on the top surface and thesidewall of each of the first and second wirings 132 and 142 in theperipheral region 120. Here, the compensation layer 160 may includesubstantially the same material as the insulation interlayer 235, e.g.,the compensation layer 160 and the insulation interlayer 235 may beparts of a same layer. The compensation layer 160 may be disposedbetween the first and second wirings 132 and 142, and the encapsulationlayer 150, so that the compensation layer 160 may compensate the steppedregion derived from the first and second wirings 132 and 142, and damage(e.g., a crack) on the encapsulation layer 150 may be prevented.

FIG. 5 is a cross-sectional view illustrating a cross-sectional viewtaken along line I-I′ in FIG. 1 in accordance with other embodiments.

Referring to FIG. 5, an organic light-emitting display device 100′ mayinclude the substrate 200, the pixel circuit, the first wiring part 130,the second wiring part 140, the compensation layer 160, the organiclight-emitting structure 330, the encapsulation layer 150, etc. Inexample embodiments, the first wiring part 130 may include the firstwiring 132 and a third wiring 134, and the second wiring part 140 mayinclude the second wiring 142 and a fourth wiring 144. The organiclight-emitting structure 330 may include the pixel electrode 260, theorganic light-emitting layer 280 and the common electrode 290, etc.Detailed description of elements in FIG. 5 which are substantially thesame as or similar to those described previously with reference to FIG.4 will not be repeated.

The pixel circuit may include the driving transistor 310 and thecapacitor 320. The pixel circuit may further include the switchingtransistor, however, the switching transistor is not illustrated in FIG.5 for convenience of illustration. For example, each of the drivingtransistor 310 and the switching transistor may correspond to a thinfilm transistor. The driving transistor 310 may include an activepattern 210, a second gate electrode 230 a, the source electrode 240,and the drain electrode 245. The capacitor 320 may include a first gateelectrode 220 and a third gate electrode 230 b.

The first gate electrode 220 may be disposed on the gate insulation 215in the display region 110. For example, the first gate electrode 220 mayinclude aluminum (Al), silver (Ag), tungsten (W), copper (Cu), nickel(Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt),tantalum (Ta), neodymium (Nd), scandium (Sc), alloys thereof, ornitrides thereof. These may be used alone or in a combination thereof.

The first wiring 132 and the second wiring 142 may be disposed on thegate insulation layer 215 in the peripheral region 120. The first wiring132 and the second wiring 142 may be spaced apart from each other at apredetermined distance, and may be disposed at substantially the samelevel over the substrate 200. Moreover, the first and second wirings 132and 142 may be disposed at substantially the same level as the firstgate electrode 220 over the substrate 200. In example embodiments, thefirst and second wirings 132 and 142 may include substantially the samematerial as the first gate electrode 220.

A second gate insulation layer 225 may be disposed on the first gateinsulation layer 215 in the display region 110 to substantially coverthe first gate electrode 220. The second gate insulation layer 225 mayinsulate the first gate electrode 220 and the third gate electrode 230 bwhich are electrodes of the capacitor 320. For example, the second gateinsulation layer 225 may include silicon oxide (SiO_(x)), siliconnitride (SiN_(x)), silicon oxynitride (SiO_(x)N_(y)), etc. Here, thesecond gate insulation layer 225 may have a single layer structure or amulti-layer structure.

An interwiring insulation layer 190 may be disposed on the first gateinsulation layer 215 in the peripheral region 120 to substantiallysurround a top surface and a sidewall of each of the first and secondwirings 132 and 142. In example embodiments, the second gate insulationlayer 225 and the interwiring insulation layer 190 may be disposed atsubstantially the same level over the substrate 200. In other words, thesecond gate insulation layer 225 may extend from the display region 110to the peripheral region 120, and may serve as the interwiringinsulation layer 190 substantially surrounding the top surface and thesidewall of each of the first and second wirings 132 and 142 in theperipheral region 120. Here, the interwiring insulation layer 190 mayinclude substantially the same material as the second gate insulationlayer 225, e.g., the interwiring insulation layer 190 and the secondgate insulation layer 225 may be parts of a same layer.

The second gate electrode 230 a and the third gate electrode 230 b maybe disposed on the second gate insulation layer 215. The second gateelectrode 230 a and the third gate electrode 230 b may be disposed overthe active pattern 210 and the first gate electrode 220, respectively.For example, each of the second and third gate electrodes 230 a and 230b may include aluminum (Al), silver (Ag), tungsten (W), copper (Cu),nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum(Pt), tantalum (Ta), neodymium (Nd), scandium (Sc), alloys thereof, ornitrides thereof. These may be used alone or in a combination thereof.

In example embodiments, the third wiring 134 and the fourth wiring 144may be disposed on the interwiring insulation layer 190. The thirdwiring 134 and the fourth wiring 144 may substantially overlap the firstwiring 132 and the second wiring 142, respectively. The third wiring 134and the fourth wiring 144 may be spaced apart from each other at apredetermined distance, and may be disposed at substantially the samelevel over the substrate 200. Moreover, the third and fourth wirings 134and 144 may be disposed at substantially the same level as the secondand third gate electrodes 230 a and 230 b over the substrate 200. Inexample embodiments, the third and fourth wirings 134 and 144 mayinclude substantially the same material as the second and third gateelectrodes 230 a and 230 b.

The third wiring 134 may be electrically connected to the first wiring132, and the fourth wiring 144 may be electrically connected to thesecond wiring 142. In example embodiments, the third and fourth wirings134 and 144 may contact the first and second wirings 132 and 142,respectively, through contact holes 172 and 174. More specifically, afirst contact hole 172 exposing the first wiring 132 and a secondcontact hole 174 exposing the second wiring 142 may be provided in theinterwiring insulation layer 190. The third wiring 134 may fill thefirst contact hole 172 to contact the first wiring 132, and the fourthwiring 144 may fill the second contact hole 174 to contact the secondwiring 142. Therefore, a resistance of each of the first wiring part 130and the second wiring part 140 may be decreased.

The compensation layer 160 may be disposed between the third and fourthwirings 134 and 144, and the encapsulation layer 150, and may surroundthe top surface and the sidewall of each of the third and fourth wirings134 and 144. The compensation layer 160 may be disposed on theinterwiring insulation layer 190 in the peripheral region 120. Inexample embodiments, the compensation layer 160 and the insulationinterlayer 235 may be disposed at substantially the same level over thesubstrate 200. In other words, the insulation interlayer 235 may extendfrom the display region 110 to the peripheral region 120, and may serveas the compensation layer 160 substantially surrounding the top surfaceand the sidewall of each of the third and fourth wirings 134 and 144 inthe peripheral region 120. The compensation layer 160 may compensate thestepped region derived from the third and fourth wirings 134 and 144.Here, the compensation layer 160 may include substantially the samematerial as the insulation interlayer 235.

The compensation layer 160 may be disposed between the third and fourthwirings 134 and 144, and the encapsulation layer 150, so that thecompensation layer 160 may compensate the stepped region derived fromthe third and fourth wirings 134 and 144 as illustrated in a portion ‘Z’in FIG. 5, and damage (e.g., a crack) on the encapsulation layer 150 maybe prevented.

The organic light-emitting display device according to exampleembodiments may be applied to various electronic devices. For example,the organic light-emitting display devices may be applied to computers,notebooks, mobile phones, smart phones, smart pads, personal mediaplayers, personal digital assistants, MP3 players, digital cameras,video camcorders, etc.

By way of summation and review, power voltage wirings including metalmay be located in a peripheral region of the organic light-emittingdisplay device. When the encapsulation layer is disposed on and directlycontacts the power voltage wirings, the encapsulation layer may bedamaged or cracked due to stress generated from the power voltagewirings.

In contrast, example embodiments provide an organic light-emittingdisplay device including a compensation layer that compensates for astepped region derived from wirings. That is, according to exampleembodiments, the organic light-emitting display device may include thecompensation layer disposed between the first and second wirings, andthe encapsulation layer, so that the stepped region derived from thefirst and second wirings may be substantially compensated, and damage(e.g., crack) to the encapsulation layer may be prevented. Furthermore,the organic light-emitting display device may further include the thirdand fourth wirings electrically connected to the first and secondwirings, respectively, such that electrical resistance of the first andsecond wirings may be decreased, and electrical properties of theorganic light-emitting display device may be improved.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. An organic light-emitting display device,comprising: a substrate having a display region and a peripheral region;a plurality of pixels on the substrate in the display region; a firstwiring and a second wiring on the substrate in the peripheral region; acompensation layer on the first and second wirings, the compensationlayer surrounding a top surface and a sidewall of each of the first andsecond wirings; and an encapsulation layer on the plurality of pixelsand on the compensation layer.
 2. The organic light-emitting displaydevice as claimed in claim 1, wherein the compensation layer compensatesa stepped region of the first and second wirings.
 3. The organiclight-emitting display device as claimed in claim 1, wherein the firstwiring supplies a driving voltage to the plurality of pixels, and thesecond wiring supplies a common voltage to the plurality of pixels. 4.The organic light-emitting display device as claimed in claim 1, whereineach of the plurality of pixels includes: a pixel circuit having anactive pattern, a gate electrode, an insulation interlayer, a sourceelectrode, and a drain electrode; and an organic light-emittingstructure having a pixel electrode, an organic light-emitting layer, anda common electrode, the organic light-emitting structure beingelectrically connected to the pixel circuit.
 5. The organiclight-emitting display device as claimed in claim 4, wherein the firstwiring, the second wiring, and the gate electrode are at a same levelover the substrate.
 6. The organic light-emitting display device asclaimed in claim 4, wherein the compensation layer and the insulationinterlayer are at a same level over the substrate.
 7. The organiclight-emitting display device as claimed in claim 4, wherein each of theplurality of pixels further includes: an insulation layer between thesource and the drain electrodes, and the pixel electrode; and a pixeldefining layer on the insulation layer, the pixel defining layerexposing a portion of the pixel electrode.
 8. The organic light-emittingdisplay device as claimed in claim 1, wherein the encapsulation layerincludes at least one organic layer and at least one inorganic layer. 9.The organic light-emitting display device as claimed in claim 1, whereinthe encapsulation layer includes a first inorganic layer, an organiclayer, and a second inorganic layer stacked on top of each other.
 10. Anorganic light-emitting display device, comprising: a substrate having adisplay region and a peripheral region; a plurality of pixels on thesubstrate in the display region; a first wiring and a second wiring onthe substrate in the peripheral region; an interwiring insulation layersurrounding a top surface and a sidewall of each of the first and secondwirings; a third wiring on the interwiring insulation layer, the thirdwiring being electrically connected to the first wiring; a fourth wiringon the interwiring insulation layer, the fourth wiring beingelectrically connected to the second wiring; a compensation layer on thethird and fourth wirings, the compensation layer surrounding a topsurface and a sidewall of each of the third and fourth wirings; and anencapsulation layer on the plurality of pixels and on the compensationlayer.
 11. The organic light-emitting display device as claimed in claim10, wherein the compensation layer compensates a stepped region of thethird and fourth wirings.
 12. The organic light-emitting display deviceas claimed in claim 10, wherein the first and the third wirings supply adriving voltage to the plurality of pixels, and the second and thefourth wirings supply a common voltage to the plurality of pixels. 13.The organic light-emitting display device as claimed in claim 10,wherein: the interwiring insulation layer has a first contact holeexposing the first wiring and a second contact hole exposing the secondwiring, and the third wiring fills the first contact hole to contact thefirst wiring, and the fourth wiring fills the second contact hole tocontact the second wiring.
 14. The organic light-emitting display deviceas claimed in claim 10, wherein each of the plurality of pixelsincludes: a pixel circuit having an active pattern, a first gateelectrode, a gate insulation layer, a second gate electrode, aninsulation interlayer, a source electrode, and a drain electrode; and anorganic light-emitting structure having a pixel electrode, an organiclight-emitting layer, and a common electrode, the organic light-emittingstructure being electrically connected to the pixel circuit.
 15. Theorganic light-emitting display device as claimed in claim 14, whereinthe first wiring, the second wiring, and the first gate electrode are ata same level over the substrate.
 16. The organic light-emitting displaydevice as claimed in claim 15, wherein the third wiring, the fourthwiring, and the second gate electrode are at a same level over thesubstrate.
 17. The organic light-emitting display device as claimed inclaim 15, wherein the compensation layer and the insulation interlayerare at a same level over the substrate.
 18. The organic light-emittingdisplay device as claimed in claim 17, wherein the interwiringinsulation layer and the gate insulation layer are at a same level overthe substrate.
 19. The organic light-emitting display device as claimedin claim 14, wherein each of the plurality of pixels further includes:an insulation layer between the source and the drain electrodes, and thepixel electrode; and a pixel defining layer on the insulation layer, thepixel defining layer exposing a portion of the pixel electrode.
 20. Theorganic light-emitting display device as claimed in claim 10, whereinthe encapsulation layer includes at least one organic layer and at leastone inorganic layer.